Samsung Electronics Roadmap Includes 1.4-nm Production by 2027

Samsung Electronics company is planning for 1.4-nm production by 2027, according to a roadmap it publicized for its chip foundry business.

The company is raising the ante with top rival Taiwan Semiconductor Manufacturing Co. (TSMC) as demand for advanced semiconductors has soared.

Samsung said high-performance computing (HPC), AI, 5G/6G, and automotive applications are driving demand.

“The technology development goal down to 1.4 nm and foundry platforms specialized for each application, together with stable supply through consistent investment, are all part of Samsung’s strategies to secure customers’ trust and support their success,”

Si-young Choi, foundry business president at Samsung Electronics, said in a prepared statement.

“Realizing every customer’s innovation with our partners has been at the core of our foundry service.”

The company this year was first to announce 3-nm production.

Samsung will enhance its gate-all-around (GAA) technology with plans to introduce a 2-nm process in 2025.

The company did not disclose figures on investment in capacity expansion.

Foundries like TSMC and Samsung have outpaced growth in the semiconductor industry.

The 31% increase in chip foundry revenue to $100.2 billion led growth in the overall semiconductor industry last year, according to market research firm Gartner. In the advanced 7-nm and 5-nm nodes, where TSMC had more than 90% of the market, the company’s key customers were Apple, AMD, and MediaTek, according to Gartner.

Samsung’s main customers—Qualcomm, Nvidia, and Tesla—counted on the company for production of less advanced 8-nm and 14-nm chips, according to the market research firm.

In addition to TSMC, Samsung will face growing competition from Intel Foundry Services (IFS), which started business about a year ago. IFS plans to offer its own GAA-based process at its 18-A node that’s equivalent to 2 nm by 2024.

TSMC will start production of 2-nm chips in 2025.

3D packaging

Samsung is accelerating the development of 2.5D/3D heterogeneous integration packaging for foundry customers.

The company said its X-Cube 3D packaging with micro-bump interconnect will be ready for production in 2024, and a bump-less version of X-Cube will be available in 2026.

Samsung is targeting high-performance and low-power segments in HPC, automotive, 5G, and the internet of things. The company will enhance its GAA-based 3-nm process support for HPC and mobile, while diversifying a 4-nm process customized for HPC and automotive applications.

For automotive customers, Samsung provides an embedded nonvolatile memory (eNVM) process based on 28-nm technology. The company plans to expand process nodes by launching 14-nm eNVM solutions in 2024 and adding 8-nm eNVM at an undisclosed date.

Samsung is in production of 8-nm RF, with 5-nm RF under development.

The company said it plans to triple its production capacity for advanced nodes by 2027.

Samsung’s foundry facilities are located in South Korea and Texas.

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